EduDIC -educational training tool
EduDIC is a complete measurement system designed as a simple and convenient educational training tool for academic courses in experimental solid mechanics. This easy-to-use system allows academic instructors to effectively present the optical measurement technique of DIC for materials testing to the engineers and scientists of tomorrow.
DIC Standard 3D
The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.
The Q-400 μDIC system is specially designed for measurement of warpage and thermal expansion within the micro-electronics/components industry working with electronic miniaturization and high-density package design.
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase.
The 3D High-Speed Image Correlation System Q-450 allows the full-field, non-contact and three-dimensional dynamic measurement of shape, displacements and strains on components and structures made from almost any material. Based on the digital image correlation technique, the Q-450 system is designed for full-field vibration analysis and high speed transient events.
The Videoextensometer RTSS is perfectly suited for the determination of material properties in tension tests. The specimen’s deformation is measured contactlessly. Properties like Stress-strain curves, E-modulus and Poisson’s ratio are determined.